# SUNMMIO

> China-based 3D TokenPU processors for AI inference.

## Why it is interesting

SUNMMIO combines memory stacking with inference-specific architecture to address data movement. Commercial value depends on yield, thermal behavior, software compatibility and delivered workload economics.

## Profile

- **Latest funding:** Pre-A2 (including extension) and Series A — Undisclosed; nearly RMB2B cumulative financing over one year (October 14, 2026)
- **Latest known valuation:** Not publicly disclosed
- **Total disclosed equity funding:** Not publicly disclosed
- **Stage:** series-a
- **Status:** private
- **Industries:** hardware-semiconductors, ai-ml, deep-tech
- **Coverage:** full
- **Last updated:** 2026-10-15
- **Latest funding investors:** E-Town Capital (亦庄国投), Other Beijing state-backed platforms, unnamed

## Key facts

- Nearly RMB2B is cumulative one-year funding, not the size of the October financings.
- 16TB/s bandwidth is a design claim, not an independently verified production benchmark.

## Funding history

- Pre-A2 (including extension) and Series A · Undisclosed; nearly RMB2B cumulative financing over one year · October 14, 2026
  Source: https://finance.sina.com.cn/tech/roll/2026-10-14/doc-inivekpp8497177.shtml

## Investors in our directory

- https://venturecapitaltracker.com/fund/e-town-capital

## Related articles

- https://venturecapitaltracker.com/sunmmio-pre-a2-series-a-3d-ai-chips

**By:** [Venture Capital Tracker](https://venturecapitaltracker.com/editorial-policy)
**Last updated:** October 15, 2026

**Editorial note:** AI tools assisted with research, structure, or drafting. Venture Capital Tracker retains human editorial responsibility for factual accuracy, relevance, and source quality before publication.

---
Source: https://venturecapitaltracker.com/startup/sunmmio