# Photonect

> Laser fusion fiber-to-chip photonic packaging (PIX-Attach) for data-center and telecom optics.

## Why it is interesting

Rochester Institute of Optics spinout attacking photonics' packaging bottleneck — adhesive-free laser bonds in under a minute with <1 dB loss. NSF SBIR Phase II $1.25M (2025) to industrialize PIX-Attach; UR PhD founder Juniyali Nauriyal built the tech through I-Corps and Activate.

## Profile

- **Latest funding:** Not publicly disclosed
- **Latest known valuation:** Not publicly disclosed
- **Total disclosed equity funding:** Not publicly disclosed
- **Stage:** seed
- **Status:** private
- **Industries:** deep-tech, hardware-semiconductors
- **Coverage:** full
- **Last updated:** 2026-07-29

## Key facts

- HQ 260 E Main St, Rochester, NY (Luminate corridor)
- NSF SBIR Phase II $1.25M (2025) for PIX-Attach industrialization
- Laser fusion fiber attach: <1 dB loss, 10× throughput claim vs manual
- Founder UR Institute of Optics PhD Juniyali Nauriyal

## Funding history

- Grant (SBIR Phase II) · $1.25M · June 2025
  Source: https://www.photonectcorp.com/post/photonect-awarded-1-25m-nsf-sbir-phase-ii-grant-to-advance-automated-photonic-packaging

## Related articles

- https://venturecapitaltracker.com/rochester-ny-startups-and-vc-firms-2026

**By:** [Venture Capital Tracker](https://venturecapitaltracker.com/editorial-policy)
**Last updated:** July 29, 2026

**Editorial note:** AI tools assisted with research, structure, or drafting. Venture Capital Tracker retains human editorial responsibility for factual accuracy, relevance, and source quality before publication.

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Source: https://venturecapitaltracker.com/startup/photonect