# Langxi Technology

> Shanghai semiconductor-components company that raised nearly RMB 200 million in a Pre-A+ round for silicon passive components used near high-performance chips.

## Why it is interesting

Advanced packaging and power delivery around CPUs/GPUs is a growing AI-infrastructure bottleneck, making Langxi a relevant semiconductor entity despite limited English-language search demand.

## Profile

- **Latest funding:** Pre-A+ — Nearly RMB 200M (September 24, 2026)
- **Latest known valuation:** Not publicly disclosed
- **Total disclosed equity funding:** Not publicly disclosed
- **Stage:** other
- **Status:** private
- **Industries:** N/A
- **Coverage:** full
- **Last updated:** 2026-09-30
- **Latest funding investors:** GL Ventures, Zhiwei Capital, SenseTime Guoxiang Capital, Jiayi Venture Capital, Feitu Venture Capital, Zhongqi Capital, Oriental Fortune Capital

## Key facts

- Sep 24, 2026: nearly RMB 200M Pre-A+
- Cumulative financing reported at nearly RMB 300M
- Focus: silicon passive components for advanced packaging

## Funding history

- Pre-A+ · Nearly RMB 200M · September 24, 2026
  Source: https://eu.36kr.com/en/newsflashes/3996751773782147

**By:** [Venture Capital Tracker](https://venturecapitaltracker.com/editorial-policy)
**Last updated:** September 30, 2026

**Editorial note:** AI tools assisted with research, structure, or drafting. Venture Capital Tracker retains human editorial responsibility for factual accuracy, relevance, and source quality before publication.

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Source: https://venturecapitaltracker.com/startup/langxi-technology